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期刊名字 | IEEE Transactions on Components Packaging and Manufacturing Technology IEEE T COMP PACK MAN （此期刊被最新的JCR期刊SCIE收录） LetPub评分 6.3
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声誉 6.9 影响力 5.4 速度 7.7 | |||||||||||||||||||||||||||||||||||||||||
| 期刊ISSN | 2156-3950 | 安装APP，查看期刊最新消息
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| E-ISSN | 2156-3985 | |||||||||||||||||||||||||||||||||||||||||
| 2025-2026最新影响因子 （数据来源于搜索引擎） | 3.3 点击查看影响因子趋势图 | |||||||||||||||||||||||||||||||||||||||||
| 实时影响因子 | 截止2026年5月06日：3.25 | |||||||||||||||||||||||||||||||||||||||||
| 2025-2026自引率 | 12.1%点击查看自引率趋势图 | |||||||||||||||||||||||||||||||||||||||||
| 五年影响因子 | 3.4 | |||||||||||||||||||||||||||||||||||||||||
| JCI期刊引文指标 | 0.6 | |||||||||||||||||||||||||||||||||||||||||
| h-index | 39 | |||||||||||||||||||||||||||||||||||||||||
| CiteScore （ 2026年6月最新版） |
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| 期刊简介 |
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| 期刊官方网站 | https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT | |||||||||||||||||||||||||||||||||||||||||
期刊投稿格式模板 VIP专享 |
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| 期刊投稿网址 | ||||||||||||||||||||||||||||||||||||||||||
| 该期刊中国学者近期发文 - New | A Miniaturized 3-D Integrated Low-Pass Filter Using a Novel Flexibly Configurable Three-Port Capacitor Based on TSV Technology Author: Yin, Xiangkun; Li, Xiang; Wang, Fengjuan; Zhang, Tao; Lu, Qijun; Zhu, Zhangming Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 922-925. DOI: 10.1109/TCPMT.2026.3667873 Crosstalk Suppression Method at the End of Multiconductor Transmission Lines Based on Crosstalk Factor Theory Author: Yin, Baiqiang; Cheng, Dalong; Wang, Ruoyu; Zuo, Lei; Li, Bing Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 861-871. DOI: 10.1109/TCPMT.2026.3667710 An Active Tangential Electric Field Probe for Switching Noise Diagnosis in Power Modules Author: Yi, Zhiqiang; Li, Linyan; Guo, Shuaibing; Huang, Zhanjun; Ruan, Litao; Li, Hui; Wang, Zhizhe; Shao, E.; Shi, Yunlei; Zhang, Maning; Shao, Weiheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 729-735. DOI: 10.1109/TCPMT.2026.3664987 Design and Manufacturing of Double-Sided SiP Power Modules via Temporary Carrier-Based Process Author: Wu, Ping; Liao, Linjie; Sun, Guoliao; Liu, Zhen; Liu, Minxuan; Teng, Xiaodong; Qiu, Yiou; Fu, Linzheng; Zhu, Wenhui; Wang, Liancheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 899-907. DOI: 10.1109/TCPMT.2026.3666192 | |||||||||||||||||||||||||||||||||||||||||
| 期刊语言要求 | 经LetPub语言功底雄厚的美籍native English speaker精心编辑的稿件，不仅能满足IEEE Transactions on Components Packaging and Manufacturing Technology的语言要求，还能让IEEE Transactions on Components Packaging and Manufacturing Technology编辑和审稿人得到更好的审稿体验，让稿件最大限度地被IEEE Transactions on Components Packaging and Manufacturing Technology编辑和审稿人充分理解和公正评估。LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）帮助作者准备稿件，已助力全球15万+作者顺利发表论文。部分发表范例可查看：服务好评 论文致谢 。
提交文稿 | |||||||||||||||||||||||||||||||||||||||||
| 是否OA开放访问 | No | |||||||||||||||||||||||||||||||||||||||||
| 通讯方式 | 445 HOES LANE, PISCATAWAY, USA, NJ, 08855-4141 | |||||||||||||||||||||||||||||||||||||||||
| 出版商 | Institute of Electrical and Electronics Engineers Inc. | |||||||||||||||||||||||||||||||||||||||||
| 涉及的研究方向 | ENGINEERING, MANUFACTURING-ENGINEERING, ELECTRICAL & ELECTRONIC | |||||||||||||||||||||||||||||||||||||||||
| 出版国家或地区 | UNITED STATES | |||||||||||||||||||||||||||||||||||||||||
| 出版语言 | English | |||||||||||||||||||||||||||||||||||||||||
| 出版周期 | ||||||||||||||||||||||||||||||||||||||||||
| 出版年份 | 2011 | |||||||||||||||||||||||||||||||||||||||||
| 年文章数 | 296点击查看年文章数趋势图 | |||||||||||||||||||||||||||||||||||||||||
| Gold OA文章占比 | 3.65% | |||||||||||||||||||||||||||||||||||||||||
| 研究类文章占比： 文章 ÷（文章 + 综述） | 100.00% | |||||||||||||||||||||||||||||||||||||||||
| WOS期刊JCR分区 （ 2025-2026年最新版） | WOS分区等级：2区
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| 期刊分区表预警名单 | 2026年03月发布的新锐学术版：不在预警名单中 2025年03月发布的2025版：不在预警名单中 2024年02月发布的2024版：不在预警名单中 2023年01月发布的2023版：不在预警名单中 2021年12月发布的2021版：不在预警名单中 2020年12月发布的2020版：不在预警名单中 | |||||||||||||||||||||||||||||||||||||||||
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| 《新锐期刊分区表》 （ 2026年3月发布） | 点击查看期刊分区表趋势图
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| 期刊分区表 （ 2025年3月升级版） |
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| 期刊分区表 （ 2023年12月旧的升级版） |
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| SCI期刊收录coverage | Science Citation Index Expanded (SCIE) (2020年1月，原SCI撤销合并入SCIE，统称SCIE) Scopus (CiteScore) | |||||||||||||||||||||||||||||||||||||||||
| PubMed Central (PMC)链接 | http://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D | |||||||||||||||||||||||||||||||||||||||||
| 平均审稿速度 | 网友分享经验： 一般,3-6周 | |||||||||||||||||||||||||||||||||||||||||
| 平均录用比例 | 网友分享经验： 容易 | |||||||||||||||||||||||||||||||||||||||||
| LetPub助力发表 | 经LetPub编辑的稿件平均录用比例是未经润色的稿件的1.5倍，平均审稿时间缩短40%。众多作者在使用LetPub的专业SCI论文编辑服务（包括SCI论文英语润色，同行资深专家修改润色，SCI论文专业翻译，SCI论文格式排版，专业学术制图等）后论文在IEEE Transactions on Components Packaging and Manufacturing Technology顺利发表。
快看看作者怎么说吧：服务好评 论文致谢 。 提交文稿 | |||||||||||||||||||||||||||||||||||||||||
| 期刊常用信息链接 | ||||||||||||||||||||||||||||||||||||||||||
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| 中国学者近期发表的论文 | |
| 1. | A Miniaturized 3-D Integrated Low-Pass Filter Using a Novel Flexibly Configurable Three-Port Capacitor Based on TSV Technology Author: Yin, Xiangkun; Li, Xiang; Wang, Fengjuan; Zhang, Tao; Lu, Qijun; Zhu, Zhangming Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 922-925. DOI: 10.1109/TCPMT.2026.3667873 DOI |
| 2. | Crosstalk Suppression Method at the End of Multiconductor Transmission Lines Based on Crosstalk Factor Theory Author: Yin, Baiqiang; Cheng, Dalong; Wang, Ruoyu; Zuo, Lei; Li, Bing Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 861-871. DOI: 10.1109/TCPMT.2026.3667710 DOI |
| 3. | An Active Tangential Electric Field Probe for Switching Noise Diagnosis in Power Modules Author: Yi, Zhiqiang; Li, Linyan; Guo, Shuaibing; Huang, Zhanjun; Ruan, Litao; Li, Hui; Wang, Zhizhe; Shao, E.; Shi, Yunlei; Zhang, Maning; Shao, Weiheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 729-735. DOI: 10.1109/TCPMT.2026.3664987 DOI |
| 4. | Design and Manufacturing of Double-Sided SiP Power Modules via Temporary Carrier-Based Process Author: Wu, Ping; Liao, Linjie; Sun, Guoliao; Liu, Zhen; Liu, Minxuan; Teng, Xiaodong; Qiu, Yiou; Fu, Linzheng; Zhu, Wenhui; Wang, Liancheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 899-907. DOI: 10.1109/TCPMT.2026.3666192 DOI |
| 5. | A Coherent Compact Thermal Network Model (CTM) for High-Precision and Efficient Temperature Prediction in CoWoS Packaging Author: Wang, Zengyi; Shi, Gang; Zhang, Xiong; Ma, Hanzhi; Shao, Leilai; Yu, Zhiping; Zhu, Xiaolei Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 778-787. DOI: 10.1109/TCPMT.2025.3619074 DOI |
| 6. | A New Packaging Design Method for IGBT Modules Based on a Common-Emitter Inductance Decoupling Technology Author: Sun, Yameng; Chen, Anning; Liu, Xun; Song, Yifan; Zhang, Xiao; Zhou, Yang; Ma, Kun; Liu, Sheng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 718-728. DOI: 10.1109/TCPMT.2026.3666172 DOI |
| 7. | Learning-Based Power Map and HTC Estimation of Chiplet Systems From Transient Thermal Map Author: Lu, Yusong; Zhu, Wenxing; Tang, Min; Zhang, Jianhua; Chen, Liang Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 765-777. DOI: 10.1109/TCPMT.2026.3667684 DOI |
| 8. | Direct Bonding Technique for Integration and Vertical Interconnection of Metal-Air Coaxial Lines Author: Liu, Yang; Zhang, Xuyao; Zou, Shengying; Wang, Yiqun; Lin, Jie; Jin, Peng Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 908-916. DOI: 10.1109/TCPMT.2026.3666542 DOI |
| 9. | Analysis and Optimization of Random Vibration Fatigue Life for Stacked Solder Joints Based on Orthogonal Experimental Design Author: Liu, Jiahua; Huang, Chunyue; Gao, Chao; Wu, Liye; Liu, Xianjia; Liang, Ying; Cao, Zhiqin Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 749-756. DOI: 10.1109/TCPMT.2024.3452958 DOI |
| 10. | Efficient Tetrahedral SETD Implementations of Transient Electrothermal Cosimulation for Electronic Devices Author: Feng, Naixing; Xiao, Keshuang; Zheng, Fanghua; Wang, Wei; Huang, Zhixiang Journal: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 2026; Vol. 16, Issue 4, pp. 788-800. DOI: 10.1109/TCPMT.2025.3642783 DOI |
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